DISCO DAAD3220 Dicing Saw
Overview
Contact: VINSE Cleanroom
ESB 111 - Cleanroom
615-343-1468
Fee Structure
Get Access - Vanderbilt
Get Access - Non-Vanderbilt
The DISCO DAD3220 dicing saw is a multifunctional tool for precise dicing of wafers of multiple material types from semiconductor to insulating. The numerous functions allow for auto-alignment, auto-focus, and auto-kerf check functions for enhanced productivity. An Ultron Systems UH114 tape applicator and Ultron Systems UH104-8 UV lamp system is used to secure the samples during dicing with UV-release tape.
Capabilities
- Workspace: 6-inch diameter cutting table
- Maximum sample size: up to 6 inches diameter
- Cutting parameters can be adjusted in X, Y, and Z directions
- X-axis:
- Cutting range - 160 mm
- Cutting speed - 0.1-500 mm/s
- Y-axis:
- Cutting range - 162 mm
- Index step - 0.0001 mm
- Index position accuracy - 0.005/160 mm
- Z-axis:
- Max stroke - 32.2 (with 2 in diameter blades)
- Moving resolution - 0.00005
- Repeatability accuracy - 0.001
- Θ-axis:
- Max rotating angle - 320
- Spindle:
- Rated output - 1.5
- Rated torque - 0.48
- Revolution speed range - 3000-40000/min
- X-axis:
- Blades available: Z, R, V
- 5 kW spindle with shaft lock functions
- Current materials with cutting recipes: silicon, glass, sapphire, quartz
- Samples can be patterne
- More material recipes available upon request