AJA Sputter Deposition - AJA ATC 2200

Overview

Contact: VINSE Cleanroom
ESB 111 - Cleanroom
615-343-1468

Fee Structure

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The AJA ATC-2200 system is a versatile physical vapor deposition system used to deposit and co-deposit  insulators, semiconductors, and metals through DC and RF sputtering.  

Capabilties

• 4 ST-30 HV sputtering sources with 75 mm targets
• Sputter up setup - sample sits at the top of the chamber
• Co-deposition capabilities (up to 2 RF + 1 DC simultaneously)
• Current deposition materials:
• Ag, Al, Al₂O₃, Cr, Cu, Ge, HfO₂, ITO (In₂O₃/SnO₂ target), KTN (Potassium Tantalate Niobate), LiO₂, Ni, Si, Si₃N4, SiO₂, Ti, TiO₂, V, VOx, W, Y₂O₃
• Co-sputtering recipes available: CrV, Ag₉₉Al₀₁
• Additional materials available upon request
• Process gasses: Argon, Nitrogen, Oxygen
• Sample holder rotation
• Sample size:
• 5.55 inch (14 cm) diameter region for mounting samples on flat sample holders
• Wafer holders are available for 3 inch (75 mm) and 4 inch (100 mm) wafers
• Sample heating available up to 800°C
• PID loop and manual control capabilities during deposition
• Sample load lock reaches base pressure after 5 minute pump down