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AJA Sputter Deposition - AJA ATC 2200


Contact: VINSE Cleanroom
ESB 111 - Cleanroom

Fee Structure

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The AJA ATC-2200 system is a versatile physical vapor deposition system used to deposit and co-deposit  insulators, semiconductors, and metals through DC and RF sputtering.  


  • 4 ST-30 HV sputtering sources with 75 mm targets
  • Sputter up setup - sample sits at the top of the chamber
  • Co-deposition capabilities (up to 2 RF + 1 DC simultaneously)
  • Current deposition materials:
    • Ag, Al, Al2O3, Cr, Cu, Ge, HfO2, ITO (In2O3/SnO2 target), KTN (Potassium Tantalate Niobate), LiO2, Ni, Si, Si3N4, SiO2, Ti, TiO2, V, VOx, W, Y2O3
    • Co-sputtering recipes available: CrV, Ag99Al01
    • Additional materials available upon request
  • Process gasses: Argon, Nitrogen, Oxygen
  • Sample holder rotation
  • Sample size:
    • 5.55 inch (14 cm) diameter region for mounting samples on flat sample holders
    • Wafer holders are available for 3 inch (75 mm) and 4 inch (100 mm) wafers
  • Sample heating available up to 800°C
  • PID loop and manual control capabilities during deposition
  • Sample load lock reaches base pressure after 5 minute pump down