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Trion Orion II PECVD


Contact: VINSE Cleanroom
ESB 111 - Cleanroom

Fee Structure

Get Access - Vanderbilt
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The Trion Orion II is a Plasma Enhanced Vapor Deposition (PECVD) system with a vacuum loadlock that produces production-quality films on a compact platform.  Using the loadlock, dopants can be used on the PECVD films. The unique reactor design produces low stress films with excellent step coverage at low power levels.  The PECVD has many input parameters that allow control over various material properties, including permittivity, refractive index, surface roughness, surface conductivity, and extinction coefficient. 


  • Available recipes:
    • Amorphous Silicon (α-Si)
    • Hydrogenated amorphous silicon
    • Nitrides (SiNx)
    • Silicon oxide (SiO2)
    • Polysilicon (in junction with other VINSE cleanroom equipment)
    • Amorphous silicon carbide
    • Other recipes can be requested
  • Process gases:
    • Silane (10% SiH4 in He)
    • Nitrogen
    • Nitrous oxide (N2O)
    • CF4
    • Oxygen
    • Hydrogen
    • Ammonia (NH3)
    • Phosphine (PH3)
  • Low temperature deposition available (0-400°C)
  • Sample size: graphite carrier plate with 4-inch milled recess
    • Maximum: 4 inch wafer
    • Minimum: ~1 cm x 1 cm chip
    • 6 inch wafer carrier can be ordered on request
  • Pressure range: 0 - 1500 mT