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Advanced Imaging Capabilities

The VINSE Advanced Imaging suite holds four imaging bays to host our modern electron, ion and scanning probe instrumentation for the characterization of nanomaterials and devices. 

Bruker Dimension Icon AFM   |   Helios Nanolab G3 CX Dual Beam FIB  |  Tecnai Osiris TEM/STEM  |  Zeiss Merlin SEM

Bruker Dimension Icon AFM

  • X-Y scan range: 90μm x 90μm typical
  • Z range: 10μm typical in imaging and force curve modes
  • Sample size/holder: 210mm vacuum chuck for samples, ≤210mm diameter, ≤15mm thick
  • Vertical noise floor: <30pm
  • X-Y position noise: <0.15nm
  • Motorized position stage (X-Y axis): 180mm × 150mm inspectable area
  • Microscope optics: 5-megapixel digital camera;
  • Digital zoom and motorized focus
  • Controller NanoScope V
  • Vibration isolation: Integrated, pneumatic
  • Acoustic isolation

AFM Modes

  • Contact Mode
  • TappingMode
  • PhaseImaging
  • ScanAsyst/PeakForce mode
  • PeakForce QNM
  • Force Spectroscopy/Force Curves
  • Force Volume
  • Piezo Response Force Microscopy
  • Lateral Force Microscopy (LFM)
  • Magnetic Force Microscopy (MFM)
  • Electric Force Microscopy (EFM)
  • Kelvin Probe Force Microscopy (KPFM-AM)/Surface Potential
  • Scanning Tunneling Microscopy (STM)
  • Torsional Resonance Mode (TRmode)
  • Scanning Thermal Microscopy (SThM)
  • Cantilever Holder for Scanning in Fluid
  • Fluid and Gas Flow Cell with 60 °C heater

Helios Nanolab G3 CX Dual Beam FIB

Electron Optics

  • Elstar UHR electron column
  • Schottky field emission source
  • 200 V to 30 kV operational range
  • Beam deceleration with stage bias from -50V to -4 kV
  • Electron probe current range: 0.8 pA to 22 nA
  • Landing energy range 20 eV to 30 keV
  • 0.8 nm resolution at 30 kV
  • 1.4 nm resolution at 1 kV
  • In-lens SE and BSE detectors (TLD)
  • Everhart-Thornley SE detector (ETD)
  • Nav Cam+
  • Concentric Backscatter Detector
  • Oxford X-Max 50 SDD EDS detection and mapping
  • Segmented STEM3 detector
  • Quorum PP3010 Cryo Preparation System and Cryo-Stage

Ion Optics

  • Tomahawk field emission focused ion beam optics
  • Liquid gallium metal ion source
  • 500 V to 30 kV operational range
  • Ion probe current range: 0.1 pA to 65 nA
  • 4.0 nm resolution at 30 kV
  • FIB optimized secondary ion and electron detector (ICE)

 Patterning, Milling and TEM Lamella Preparation

  • High resolution digital patterning engine controlled by UI
  • Maximum resolution: 64k x 64k
  • Dwell times from 25 ns/pixel to 25 ms/pixel
  • NanoBuilder Software
  • Slice and View 4 3D volumetric imaging
  • AutoTEM4
  • EasyLift EX nanomanipulator
  • Multichem gas delivery system (Pt, XeF2)
  • In-chamber plasma cleaner
  • Multisample specimen stage
  • Advanced Scripting for Python-based Automation

Tecnai Osiris TEM/STEM

  • 60 kV-200 kV operational range
  • X-FEG high brightness Schottky field emission source
  • Super X™ EDS detection system
  • 1.5 nA of beam current with sub-nm resolution
  • Selective area and convergent beam electron diffraction
  • HRTEM point resolution of 0.25 nm, 0.13 nm information limit
  • HRSTEM spatial resolution of 0.16 nm
  • HAADF (Z-contrast) STEM imaging
  • TEM, STEM, and STEM-EDS tomography
  • Amira 3D visualization software
  • Protochips Aduro in situ heating system
  • Gatan in situ heating holder
  • TrueImage exit wave reconstruction

Zeiss Merlin SEM

  • Field-emission Source
  • Gemini II Electron Column
  • Probe currents (10 pA-40nA)
  • Operation voltage: 500V-20 kV
  • 0.8 nm resolution at 20 kV
  • 1.6 nm resolution at 1 kV
  • Emitter: Schottky Type
  • InLens, HE-SE2, EsB, BSD Detectors
  • Chamber Scope
  • Oxford X-Max 50 SDD EDS detection and mapping
  • Local charge compensation via gas injection
  • Segmented STEM Detector and TEM grid holder
  • Airlock for quick sample exchange