January 31, 2005FRONTIERS IN MATERIALS SCIENCE
VINSE COLLOQUIUM SERIES
Dr. Timothy Cale
Visiting Professor, Chemical Engineering, Vanderbilt University
Professor of Chemical and Biological Engineering, Rensselaer Polytechnic University
"Multiscale Modeling: A Grain Focus"
Abstract. After motivating grain focused multiscale modeling by relating it to selected research areas, I will focus on our use of it within microelectronics research [1-4]. I will then discuss specific studies that focus on the formation and evolution of nanoscale metal interconnects (wires) used in integrated circuits. Shown below is an example of simulated annealing of a granular copper interconnect that was ‘formed’ by depositing a film using a simple electroless plating model, followed by ‘polishing’ (damascene processing). One main point will be the use of mass and energy balances in the transport and reaction models for the processes modeled. To emphasize this point, I will include a discussion of multiscale deposition process simulation, which relies on solving models from the nanometer scale to the meter scale in an truly integrated manner. I will wrap up with some thoughts on opportunities for grain based modeling and simulation.
1. M.O. Bloomfield, D.F. Richards, and T.S. Cale, Phil. Mag. 83(31-34), 3549-3568 (2003).
2. M.O. Bloomfield and T.S. Cale, Microelectron Eng. 76(1-4), 195-204 (2004).
3. M.O. Bloomfield, Y.-H. Im, and T.S. Cale, 2003 IEEE Int. Conf. on Simulation of Semiconductor Processes and Devices, (SISPAD), IEEE, 2003, pp. 19-22.
4. Y..H, Im, M.O. Bloomfield, J. Seok, C.P. Sukam, J.A. Tichy and T.S. Cale, 2003 IEEE Int. Conf. on Simulation