VINSE - Vanderbilt Institute of Nanoscale Science and Engineering

REU

Electron Optics Laboratory
Lab Director: Professor James E. Wittig 615-343-6028
Lab Contact: Dr. Anthony B.Hmelo anthony.b.hmelo@vanderbilt.edu or 615-343-7212, 6516 Stevenson Center

The VINSE Electron Optics center, located in SC 5602, is a multi-user facility for materials characterization using electron microscopy. The central instrument is a Hitachi S4200 high resolution scanning electron microscope (SEM) equipped with a cold field emission electron gun, digital imaging, and a thin-window energy dispersive x-ray spectrometer (EDS). Higher resolution is available using the Philips CM20 transmission electron microscope (TEM) with a scanning transmission (STEM) attachment and EDS detector. Support equipment includes a digital image processing lab and complete sample preparation capability for metals, semiconductors, ceramics, and polymers.

Instruments

EBL - Electron Beam Lithography Tool	EBL - Pattern Editor	EBL - Spin Coater

The Raith eLiNE is an SEM style instrument for fabricating high resolution nano-patterened devices by exposing and processing electron-sensitive resists.This tool is now operational. We welcome users interested in both state of the art SEM imaging and metrology, as well as nanofabrication. Please visit the Raith User Group Pages for more information.		The VINSE spin coater facility supports user training and the demonstration of the Raith eLiNE EBL. It is available for spinning and processing PMMA resists ONLY!
Osiris TEM	SEM - Scanning Electron Microscope	SPM - Scanning Probe Microscope
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	The Hitachi S4200 high resolution scanning electron microscope (SEM) is equipped with a cold field emission electron source, backscatter electron imaging, digital image acquisition, and a thin-window energy dispersive x-ray spectrometer (EDS) for microanalytical specimen characterization. SEM WEBSITE	JEOL 5200 SPM
TEM - Transmission Electron Microscope	Westbond Wedge Wire Bonder

TEM WEBSITE	The wedge bonder is used to bond wires between a device and external electrodes. The minimum bondable pad size is about 50X50 microns square. This wire bonder is well suited for ESD sensitive devices.