The VINSE spin coater facility supports user training and the demonstration of the Raith eLiNE EBL. It is available for spinning and processing PMMA resists ONLY!
The FEI Tecnai Osiris™ is a fully digital 200 kV S/TEM system, designed to deliver revolutionary analytical performance in all imaging and analytical modes. Tecnai Osiris features the unique ChemiSTEM™ technology which combines technical superiority in beam generation with unparallel advances in EDX signal detection.
The Hitachi S4200 high resolution scanning electron microscope (SEM) is equipped with a cold field emission electron source, backscatter electron imaging, digital image acquisition, and a thin-window energy dispersive x-ray spectrometer (EDS) for microanalytical specimen characterization. SEM WEBSITE
JEOL 5200 SPM
The wedge bonder is used to bond wires between a device and external electrodes. The minimum bondable pad size is about 50X50 microns square. This wire bonder is well suited for ESD sensitive devices.
The PHI Versaprobe is a surface-sensitive analytical tool for identifying elemental composition (Z > 2) and local bonding environment.