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REU
Facilities:

Electron Optics Laboratory
Lab Director: Professor James E. Wittig 615-343-6028
Lab Contact: Dr. Anthony B.Hmelo anthony.b.hmelo@vanderbilt.edu or 615-343-7212, 6516 Stevenson Center

The VINSE Electron Optics center, located in SC 5602,  is a multi-user facility for materials characterization using electron microscopy. The central instrument is a Hitachi S4200 high resolution scanning electron microscope (SEM) equipped with a cold field emission electron gun, digital imaging, and a thin-window energy dispersive x-ray spectrometer (EDS). Higher resolution is available using the Philips CM20 transmission electron microscope (TEM) with a scanning transmission (STEM) attachment and EDS detector. Support equipment includes a digital image processing lab and complete sample preparation capability for metals, semiconductors, ceramics, and polymers.

Instruments

CM 20 TEM - Transmission Electron MicroscopeEBL - Electron Beam Lithography ToolEBL - Pattern Editor
CM 20 TEM - Transmission Electron MicroscopeEBL - Electron Beam Lithography ToolEBL - Pattern Editor

TEM WEBSITE


The Raith eLiNE is an SEM style instrument for fabricating high resolution nano-patterened devices by exposing and processing electron-sensitive resists.This tool is now operational. We welcome users interested in both state of the art SEM imaging and metrology, as well as nanofabrication. Please visit the Raith User Group Pages for more information.



EBL - Spin CoaterOsiris TEMSEM - Scanning Electron Microscope
EBL - Spin CoaterOsiris TEMSEM - Scanning Electron Microscope

The VINSE spin coater facility supports  user training and the demonstration of the Raith eLiNE EBL. It is available for spinning and processing PMMA resists ONLY!


The FEI Tecnai Osiris™   is a fully digital 200 kV S/TEM system, designed to deliver revolutionary analytical performance in all imaging and analytical modes. Tecnai Osiris features the unique ChemiSTEM technology which combines technical superiority in beam generation with unparallel advances in EDX signal detection.


The Hitachi S4200 high resolution scanning electron microscope (SEM) is equipped with a cold field emission electron source, backscatter electron imaging, digital image acquisition, and a thin-window energy dispersive x-ray spectrometer (EDS) for microanalytical specimen characterization. SEM WEBSITE


SPM - Scanning Probe MicroscopeWestbond Wedge Wire BonderXPS - Xray photoelectron spectroscopy
SPM - Scanning Probe MicroscopeWestbond Wedge Wire BonderXPS - Xray photoelectron spectroscopy

JEOL 5200 SPM


The wedge bonder is used to bond wires between a device and external electrodes. The minimum bondable pad size is about 50X50 microns square. This wire bonder is well suited for ESD sensitive devices.


The PHI Versaprobe is a surface-sensitive analytical tool for identifying elemental composition (Z > 2) and local bonding environment.   


 
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