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Silicon Integration Laboratory
Lab Director: Professor Bridget Rogers (615) 343-3269
Lab Contact: Dr. Ben Schmidt or (615) 343-6721, 6217 D Stevenson Center

Four new tools have been installed in the VINSE laboratory for depositing and etching metals, semiconductors, and insulators. This lab is also equipped with acid and solvent fume hoods.

Tools handle 8 inch wafers down to small pieces.
Touchscreen interface for fingertip control of all process parameters.


AJA Sputter DepositionNikon MicroscopeOlympus Microscope
AJA Sputter DepositionNikon MicroscopePhoto not available

The ATC 2200 (AJA International, Inc.) is a versatile load-locked sputter coating system.  There are 4 available sputter guns which can be configured for either DC or RF magnetron sputtering.  Samples may also be heated to 800 0C and rotated for increased uniformity.  Current sputter targets are Si (undoped), SiO2, and Si3N4.  Available gases are Ar, O2, and N2.

The Nikon LV100 optical microscope offers 2.5, 10, 20, 50, and 100x magnification.  Integrated image capture software provides many options for processing.

Plasma-enhanced CVDReactive Ion Etch - Chlorine-basedReactive Ion Etch - Fluorine Based
Plasma-enhanced CVDReactive Ion Etch - Chlorine-basedReactive Ion Etch - Fluorine Based

Trion Orion II (Learn more)
Plasma enhanced chemical vapor deposition reactor for depositing:

  • Silicon dioxide
  • Silicon nitride
  • Amorphous silicon

Process gases include 10% SiH4 + He, NH3, N2O, O2, N2, and Ar

Trion Minilock II (Learn more)
Chlorine based chemistry for reactive ion etching:

  • Aluminum
  • Aluminum oxide
  • Silicon
  • Any material requiring chlorine chemistry

Process gases include Cl2, BCI3, CF4, O2, N2

Trion Phantom II (Learn more)
Fluorine based chemistry for reactive ion etching:

  • Oxides
  • Nitrides
  • Silicon
  • Polyimide
  • Any materials requiring fluorine chemistry

Process gases include CF4, CHF3, SF6, O2

RTP - Rapid Thermal Processor  
RTP - Rapid Thermal Processor  

The Solaris 150 (Surface Science Integration, Inc.) is a manual loading RTP system for R&D and pre-production. The Solaris 150 can process up to 152.4mm (6") substrates at a temperature range from RT - 1300 0C. The unique temperature measurement system of the Solaris requires virtually no calibration for different wafer types and backside emissivity differences.  The Solaris uses a unique PID process controller that ensures accurate temperature stability and uniformity.

Vanderbilt University