IEEE Components, Packaging, and Manufacturing Technology Society

CPMT Technical Committee

Thermal Management and Thermo-Mechanical Design (TC-9)

The Thermal Management and Thermomechanical Design Technical Committee is concerned with all aspects of thermal, thermo-mechanical, electro-thermal phenomena related to electronic/microelectronics packaging and electrical systems. The subjects of interest include:

Electronic Cooling and Thermal Management of Component and System
Thermal Design and Analysis
Coupled Electro-Thermal Phenomena
Thermal and Thermomechanical Measurements
Thermal Mismatches and Stressses
Temperature Induced Fracture and Moisture Stresses in IC Package
Thermomechanical Design and Analysis of Component and System
Thermomechanical Computer Aided Design and Engineering

Associated activities:

Links to other Societies and events:

For suggestions or comments on TC-9 Web Page, please contact TC-9 Webmaster. To join IEEE/CMPT TC-9, contact TC-9 Chair, Vice Chair, or Webmaster.

Dr. Tony Mak, TC Chair
Dallas Semiconductor Corp.
4401 S. Beltwood Pkwy
Building F
Dallas, TX 75244
USA
Tel: + 972-371-4364
FAX: + 972-371-4381

Professor Gerard Kelly, TC Vice Chair
Dept. of Mechanical and Manufacturing Engineering
Cork Institute of Technology
Rossa Avenue, Bishopstown
Cork, Ireland
Tel + 353 21 4326743
Fax + 353 21 4326627

Professor Tim Fisher, Webmaster
Dept. of Mechanical Engineering
Vanderbilt University
Box 1592 Station B
Nashville, TN 37235
USA
Tel + 615-322-2956
Fax + 615-343-6687

Anyone can be a participating member of one or more of the CPMT Society's TCs without belonging to the IEEE; most of our TCs have a mailing list, a newsletter, and a networking listing.

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Last Updated: May 24, 2006